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Added  Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
Aug 9 207622
FICO AMS-11-MR MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING:
AssetSNo.Asset nameAsset name2Physical LocationSerial no.
100060730FICO AMS-11-MR MOLDING201010012;Mal transfer DS line;inv#6JM/00883108 1FASSY5133182FC18
1 ¥ 4,910,590.66 N*
Aug 8 207602
TRIM FORM MACHINE 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TRIM FORM MACHINE:
AssetAsset nameAsset name2Serial no.
10007004TRIM FORM MACHINE8500033677;transfer asset from IFMY; 6JM/00758TF-17
1 ¥ 1,368,171.00 N*
Aug 8 207601
Wafer inker machine 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Wafer inker machine:
AssetAsset nameAsset name2Serial no.
10009379Wafer Inker MachineA-17-3040-37-D019-T-01; 85000803450211-3296 INK-11
10006598Wafer inker machine8500022900;transfer from IFMY; 6JM/01085APR-WX-001

 

2 ¥ 1,024,300.00 N*
Jul 16 207383

Koh Young Techn. Inc  

KY8030-2 Size L 

List all items of this typeOptical Test & Measurement Equipment - Other

in Optical Test & Measurement Equipment

3D- Inline Solder Paste Inspection System Koh Young SPI:

 3 D Solder Paste Inspection System Model KY8030-2 Size L

1 € 0.00 F*N*
Jul 16 207382
TOSOK DBD 3280/3310 Die Bond 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD 3280/3310 Die Bond:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110005747TOSOK DBD3280 Die Bond.201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747CIQ inspect fee in Malacca201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747Conversion key1(X-Y wafer holder unit)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key4(loader-unloader)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37510006006TOSOK DBD3310 Die Bond .8500008995;Mal transfer DS line;inv# 6JM/00057/65108 1F ASSY295 T25
9F37510006006Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606108 1F ASSY295 T25
9F37510005536TOSOK DBD3310 Die Bond .PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536CIQ import inspection charge for TOSOK DBD3310 DiePO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536freight: TOSOK DBD3310 Die Bond 161 T26.PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F57010006036TOSOK DBD3310 DIE BOND8500007255;Mal transfer DS line;inv# 6JM/00884108 2F ASSY182-T86

 

4 ¥ 8,799,723.91 N*
Jul 16 207381
SHINKAWA ACB35 WIRE BOND 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 WIRE BOND:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110006475SHINKAWA ACB35 WIRE BOND8500018759;transfer from IFMY;inv# 6JM/00925108 1F ASSYF0-36534 S23

 

1 ¥ 932,760.30 N*
Jul 12 207363

Datacon  

2206 amp+ 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

DATACON Flip Chip Bonder 2206 amp+:

Correct Maintained

Complete. No parts missing

1 € 32,900.00 N*
Jul 12 207362
Wire Bonder UTC-3000 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire Bonder UTC-3000:

Serial number: 66330

Correct maintained

Complete. No parts missing

 

1   F*N*
Jul 11 207356
SPEA Tester 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

SPEA Tester:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F40510004286SPEA C320MX TesterPO 200510501 BNE A-05-3040-41-P005-T-02CC FCOSRAE074CC
9F40510004379SPEA C320MX Tester200610235 a-06-3040-37-c004-a-01CC FCOSRAG087CC
9F40510004379freight for SPEA comptest 320-MX-32200610235 a-06-3040-37-c004-a-01CC FCOS0
9F40510004602SPEA C320MX TesterTransfer AG, PO#200710213CC FCOSRAE076CC
9F40510004646SPEA C320MX TesterTransfer AGCC FCOSRAE077CC

 

4 ¥ 7,488,255.14 N*
Jul 8 207199

ASYS  

BC0 01 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS BC0 01:

Conveyor ASYS BC0 01

1   N*
Jul 8 207198

ASYS  

TRM02 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS TRM02:

Conveyor ASYS TRM02

1   N*
Jul 8 207197

Kulicke&Soffa  

Powerfusion 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Wire Bonder K&S Powerfusion Alu Wedge Bonder:

Wire Bonder K&S Powerfusion Alu Wedge Bonder

1   N*
Jul 8 207196

VacuMit  

EST60 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Vacuum packing machine VecuMit EST60:

Vacuum packing machine VecuMit EST60, without N2 floating

1   F*N*
Jul 5 207184

Siemens  

Siemens Siplace HS 50 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Siemens Siplace HS 50 pick and place mounter:

Siemens Siplace HS 50 pick and place mounter

1   N*
Jul 5 207183

Siemens  

Siemens Siplace F4 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Siemens Siplace F4 pick and place mounter:

Siemens Siplace F4 pick and place mounter

1   N*
Jul 5 207182

EKRA  

Solder Paste Printer Ekra X5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Solder Paste Printer Ekra X5:

Solder Paste Printer Ekra X5

1   N*
Jul 5 207181

EKRA  

E4 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Solder Paste Printer Ekra E4:

Solder Paste Printer Ekra E4

1   N*
Jul 5 207180
Nanofocus µsprint 3d inspection system with Baumann Handler 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

1 € 50,000.00 N*
Jun 24 206584
Fico AMS-11-MR Molding 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Fico AMS-11-MR Molding:
AssetAsset nameAsset name2Physical LocationSerial no.
10004762Inline VI WorkStationTransfer AGCC LINE 21VIF-19
10004924Fico AMS-11-MR MoldingTransfer AG, PO#200710494CC LINE 21INF6312182
10005047Buffer200710495;A-07-3040-37-C017-T-01;IFAG#633451493CC LINE 21BF-048
10004763Inline VI WorkStationTransfer AGCC LINE 21VIB-19

 

4 ¥ 4,052,063.00 F*N*


*  Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.