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For full details, click on picture, More Info button or Item ID in listings below.
Added  Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
Jun 13 191902

Diener  

Diener Tetra 30-LF-PC 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 F*N*
Plasma Clean Machine

LOCATION: MALACCA

Jun 2 191717

THA Germany  

N/A 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Jun 2 191716

DISCO CORPORATION  

DFD 670 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Dicer DFD670, SM06
Wafer sawing for 12" wafer
Jun 1 191714

Shinkawa  

ACB 1000 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

5 N*
Wire Bonder ACB1000
To bond wire on the chip in strip to strips form
Jun 1 191713

tosok  

DBD4600VRS 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

2 N*
Die Bonder DBD4600
To bond chip from wafer into strip to strips form
May 29 191667

Buehler  

BETA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Buehler Beta Grinder/Polisher

LOCATION: Malacca
LOCATION: Malacca
May 8 191177

Tokyo Semitsu Kogaku  

 

List all items of this typeReliability Test Equipment - Other

in Reliability Test Equipment

1 N*
May 2 191094

Dainippon Screen  

SC-W60A-AV 

List all items of this typeManual Photoresist Coaters

in Photoresist Coaters

2 N*
B604 SCREEN DNS SCW60B
Coater with 4 horizontal load ports
2 coater cups
6 resist lines with 3 pumps
8 hot plates (2 of them ADH HP)
2 cool plates
1 temperature controller / unit
May 2 191093

LAM  

4520i 

List all items of this typeOxide Etchers

in Single Chamber Plasma Tools

1 N*
Lam Rainbow 4520i
Standalone single wafer oxide etch system
Isotopic chamber
Envision Software
Gases Main Chamber => CF4,CHF3,Ar,He,O2,N2
Gases ISO Chamber => NF3,O2,N2
Apr 20 190834

Preco Inc.  

7-Watt FlexStar UV Laser System 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Preco FlexStar Laser Processing System

The system is designed to cut and drill copper, polyimide, polyester, and other common flexible circuit materials and to etch ITO and other conductive films. The system is designed to process specified material in roll-to-roll format utilizing a galvanometer-steered laser to achieve superior productivity while maintaining high accuracy. The specially designed system incorporates a proprietary Preco custom-designed system that compensates for long-term position and scale variations of the galvanometer scanners on a continuing basis. The “zero drift” and “gain drift” of galvanometers often require frequent calibration to achieve high accuracy. The Preco solution can reduce the frequency of calibrations from days to several months.

The FlexStar Laser System is comprised of a diode-pumped solid-state (DPSS) UV laser. Manipulation of the laser beam is by a high-performance galvanometer scan head in cooperation with a vacuum table feed system, based on a granite support structure. The beam delivery scan head is carried on a Yaxis slide across the web and the web is indexed in the X-axis by a vacuum table.

The standard system configuration consists of the following laser source: 7-W diode-pumped solid-state (DPSS) frequency-tripled UV (355 nm) laser. An integrated closed-loop chilled-water cooling unit maintains stable operating temperature of the laser source.

 

High-performance galvanometer scan heads manipulate the laser beam within the FlexStar unit. This system is based on an F-theta telecentric scan head.

During laser processing, the material is held by a vacuum table. The working area of the table is divided into “tiles” which fit within the scan field. Each tile is located under the scan head by indexing the vacuum table in the web direction and/or the scan head in the transverse direction. Each of the stages consists of a servo-driven ballscrew assembly, air-bearings on granite ways, and glass scales. This design yields a typical accuracy of ±0.0005” (±0.012 mm), over 24” (610 mm) of travel.

The material to be processed is unwound from a single spindle with 6” (152 mm)pneumatic core chucks. The material roll can have a maximum diameter of 20” (±508 mm) and maximum width of 22” (559 mm). The web is actively guided by actuating the unwind spindle, vacuum box tension control and idle roller assembly. A vacuum drum pulls material from the outbound vacuum box. The vacuum drum also allows web tension in the laser processing area to be different than at the rewind. The rewind features an integrated active web-guide, digitally-controlled clutch for rewind tension control, and 6” (152 mm) pneumatic core chucks. Unwind and rewind modules can each be quoted with an additional spindle, which may be used for removing and/or adding overlay or interleaf material.

More details are available on request.

 

Apr 19 190817

FEI  

Tecnai 20 S-TWIN 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

1 € 150,000.00 F*N*R*
Transmission Electron Microscope Tecnai20 LaB6
TEM 200kV equipped with
 -Super TWIN lens
 -1K Gatan Multiscan CCD camera (Mod. 794)
 -EDAX EDX-system (SiLi detector ultrathin window 133eV resolution)
5-axis motorized stage
Single tilt holder

no STEM

point resolution 0,24nm
line resolution 0,14nm

Apr 13 190754

Manufacturing Integr  

MIT_LH100SP 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Laser Mark Machine, MIT_LH100SP

LOCATION: Malacca
Apr 13 190753

Manufacturing Integr  

MIT_LH100TTL 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Laser Mark Machine, MIT_LH100TTL

LOCATION: Malacca
Apr 12 190752

Kynergy  

No 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 F*N*
Detaper Machine Kynergy

LOCATION: Malacca
Mar 28 190359

DISCO CORPORATION  

DFD640 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Wafer Saw_DFD640
Tsf_Wafer Saw_DFD640_DISCO-F-003
Mar 28 190358

DISCO CORPORATION  

DFD640 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Wafer Saw_DFD640
Tsf_Wafer Saw_DFD640_DISCO-F-002
Mar 28 190357

DISCO CORPORATION  

DFD640 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Wafer Saw_DFD640
Tsf_Wafer Saw_DFD640_DISCO-F-001
Mar 17 190258

Akrion  

Gama 

List all items of this typeWet Process Equipment - Other

in Wet Processing Equipment

1 N*
Akrion Gama
Akrion Gama available from Mesa, AZ facility.
›Serial: 1071-01
›Software Rev: 6.05.009
›GEM/SECS: 3.09
›2 Input Queues
›Tank 1: HF
›Tank 2: DI Rinse
›Tank 3: SC1 (NH4OH, H2O2)
›Tank 4: Rinse
›EE Wash/Dry
›Tank 5: HF/HCl
›Tank 6: DI Rinse with HCl Inject (SC2)
›Tank 7: LuCID I Dryer
›2 Output Queues

LOCATION: Mesa
SERIAL NUMBER(S): 1071-01
Jan 31 189447

Accretech  

AD2000T 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Accretech Dicer

Dicing machine cut wafers into individual semiconductor chips with blades.

Jan 30 189446

Mühlbauer  

DS10000 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Muehlbauer Taper
Tape & reel die sorting.
Jan 30 189445

Mühlbauer  

DS10000 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Muehlbauer Taper
Tape & reel die sorting.
Nov 2 188171

DDS Development  

N/A 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 F*N*
WLP Stencil Storage Cabinet
WLP Stencil Storage Cabinet
Nov 2 188170

Advantek  

Advantech Industrial CPU 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
PC ADVANTECH INDUSTRIAL PC
Industrial CPU for tester
Nov 2 188169

Sikama International  

M:Falcon 8500  

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1 N*
Curing Oven Sikama M:Falcon 8500 & Wet Clean
Curing Oven Sikama M:Falcon 8500 & Wet Clean
Oct 6 187741

Shinkawa  

ACB 400 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

3 N*
Wire Bonder ACB400
To bond wire on the chip in strip to strips form
Oct 6 187740

Shinkawa  

ACB 400 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

5 N*
Wire Bonder ACB400
To bond wire on the chip in strip to strips form
Jul 8 177230

IPEC Westech  

AVANTI 472 

List all items of this typeCMP Polishers

in Chemical Mechanical Planarization Equipment

1 N*
Westech Avanti 472
200 Wafer Size Single Wafer Polishing; Polish Arm/Wafer Carrier; Load/Unload Station; Primary/Final Polish Table (22.5"/20.625"); Carrier Clean Station; APP1000 Pad Conditioner; Adjustable Parameters: Polish Arm Downforce and Backpressure; Polish Platen Rotational Speed; Polish Platen Temperature; Wafer Carrier Assembly Rotation Speed; Polish Arm Assembly Oscillation Speed and Distance; Slurry Pump Output; APP1000 Pad Profiling; Alarm Band Width.


*  Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.