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For full details, click on picture, More Info button or Item ID in listings below.
Added  Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
Oct 16 194713

Hitachi  

S-5200 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

1   F*N*
S-5200 Field Emission Scanning Electron Microscope:
›Features:
–Cold cathode field emission type
–Secondary electron (SE) mode
–Accelerating voltage (Vacc) 0,5 to 30kV
–Ultra-high resolution objective lens
–High magnification mode 800x to 2000kx
–Low magnification mode 60x to 10kx
–Sample holder for cross section view and top view
Aug 8 192608

Keithley  

224 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
PROGRAMMABLE CURRENT SOURCE:
KEITHLEY MODEL: 224
Aug 8 192607

THA Germany  

WLP-VISION 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Vision Mchine:
VISION MACHINE
Aug 8 192606

THA Germany  

N/A 

List all items of this typeSemiconductor Manufacturing Equipment - Other

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1   F*N*
THA Taper ETAP011:
TAPER MACHINE
Aug 7 192605

tosok  

DBD4600 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

3   F*N*
Die Bonder DBD4600, T8, TG17, TG7:
To bond chip from wafer into strip to strips form
Jul 25 192410
X Ray Tool COUGAR-VXP Series 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

1   N*
X Ray Tool COUGAR-VXP Series:

Complete X-ray Protection Cabinet with Safety Interlocks

100 kV Microfocus Demountable Open X-ray Tube with Transmission Target (2 μm Resolution)

Dual Field (6“ / 4.5“) Image Intensifier with CCD Camera

Ergonomic Workstation with 17“ Flat Screen Display Monitor, Keyboard, Joysticks and Mouse

FEINFOCUS Graphical User Interface (FGUI) Including:

- WindowsTM Operating System

- Microprocessor X-Ray Controller

- FIP-600 Real-time Image Processing System

- Ethernet Connection and CD Read Write Drive

- High Resolution Color Ink Jet Printer

3 - Motor Driven Axes Manipulation System with Software Controls

- X & Y Axes Sample Manipulation, Z Axis Tube Manipulation

1 – Manual Driven Axis Manipulation

- Z Axis Detector Manipulation

 

Jul 17 192280
Over Head Transport System (OHT) SRC320 / SRC300 / LIM  

List all items of this typeSemiconductor Facilities Equipment - Other

in Semiconductor Manufacturing Facilities Equipment

1   N*
Over Head Transport System (OHT) SRC320 / SRC300 / LIM :


FOT4 Bay
FOT1 Bay
CVD1 Bay
IMP Bay --> Coming up for sale in the middle of 2018


A high quantity of straigths, curves, course taker and other tracks

For details, please take a close look to attached description in Excel File.
Jul 12 192253

Tokyo Electron Ltd  

Stratus S200 

List all items of this typeChemical Vapor Deposition Equipment - Other

in Chemical Vapor Deposition Equipment

1   N*
NEXX Stratus 200:

Stratus 200 is high volume manufacturing electroplating system for advanced wafer level packaging (WLP) applications

Jun 13 191902

Diener  

Diener Tetra 30-LF-PC 

List all items of this typeSemiconductor Manufacturing Equipment - Other

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1   F*N*
Plasma Clean Machine:

LOCATION: MALACCA

Jun 2 191717

THA Germany  

N/A 

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in ALL CATEGORIES

1   N*
THA Taper ETAP014:
TAPER MACHINE
Jun 2 191716

DISCO CORPORATION  

DFD 670 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Dicer DFD670, SM06:
Wafer sawing for 12" wafer
Jun 1 191714

Shinkawa  

ACB 1000 

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in ALL CATEGORIES

5   N*
Wire Bonder ACB1000:
To bond wire on the chip in strip to strips form
May 29 191667

Buehler  

BETA 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Buehler Beta Grinder/Polisher:

LOCATION: Malacca
LOCATION: Malacca
May 2 191094

Dainippon Screen  

SC-W60A-AV 

List all items of this typeManual Photoresist Coaters

in Photoresist Coaters

2   N*
B604 SCREEN DNS SCW60B:
Coater with 4 horizontal load ports
2 coater cups
6 resist lines with 3 pumps
8 hot plates (2 of them ADH HP)
2 cool plates
1 temperature controller / unit
Apr 20 190834

Preco Inc.  

7-Watt FlexStar UV Laser System 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Preco FlexStar Laser Processing System:

The system is designed to cut and drill copper, polyimide, polyester, and other common flexible circuit materials and to etch ITO and other conductive films. The system is designed to process specified material in roll-to-roll format utilizing a galvanometer-steered laser to achieve superior productivity while maintaining high accuracy. The specially designed system incorporates a proprietary Preco custom-designed system that compensates for long-term position and scale variations of the galvanometer scanners on a continuing basis. The “zero drift” and “gain drift” of galvanometers often require frequent calibration to achieve high accuracy. The Preco solution can reduce the frequency of calibrations from days to several months.

The FlexStar Laser System is comprised of a diode-pumped solid-state (DPSS) UV laser. Manipulation of the laser beam is by a high-performance galvanometer scan head in cooperation with a vacuum table feed system, based on a granite support structure. The beam delivery scan head is carried on a Yaxis slide across the web and the web is indexed in the X-axis by a vacuum table.

The standard system configuration consists of the following laser source: 7-W diode-pumped solid-state (DPSS) frequency-tripled UV (355 nm) laser. An integrated closed-loop chilled-water cooling unit maintains stable operating temperature of the laser source.

 

High-performance galvanometer scan heads manipulate the laser beam within the FlexStar unit. This system is based on an F-theta telecentric scan head.

During laser processing, the material is held by a vacuum table. The working area of the table is divided into “tiles” which fit within the scan field. Each tile is located under the scan head by indexing the vacuum table in the web direction and/or the scan head in the transverse direction. Each of the stages consists of a servo-driven ballscrew assembly, air-bearings on granite ways, and glass scales. This design yields a typical accuracy of ±0.0005” (±0.012 mm), over 24” (610 mm) of travel.

The material to be processed is unwound from a single spindle with 6” (152 mm)pneumatic core chucks. The material roll can have a maximum diameter of 20” (±508 mm) and maximum width of 22” (559 mm). The web is actively guided by actuating the unwind spindle, vacuum box tension control and idle roller assembly. A vacuum drum pulls material from the outbound vacuum box. The vacuum drum also allows web tension in the laser processing area to be different than at the rewind. The rewind features an integrated active web-guide, digitally-controlled clutch for rewind tension control, and 6” (152 mm) pneumatic core chucks. Unwind and rewind modules can each be quoted with an additional spindle, which may be used for removing and/or adding overlay or interleaf material.

More details are available on request.

 

Apr 19 190817

FEI  

Tecnai 20 S-TWIN 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

1 € 150,000.00 F*N*R*
Transmission Electron Microscope Tecnai20 LaB6:
TEM 200kV equipped with
 -Super TWIN lens
 -1K Gatan Multiscan CCD camera (Mod. 794)
 -EDAX EDX-system (SiLi detector ultrathin window 133eV resolution)
5-axis motorized stage
Single tilt holder

no STEM

point resolution 0,24nm
line resolution 0,14nm

Apr 13 190754

Manufacturing Integr  

MIT_LH100SP 

List all items of this typeSemiconductor Manufacturing Equipment - Other

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1   N*
Laser Mark Machine, MIT_LH100SP:

LOCATION: Malacca
Apr 13 190753

Manufacturing Integr  

MIT_LH100TTL 

List all items of this typeSemiconductor Manufacturing Equipment - Other

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1   N*
Laser Mark Machine, MIT_LH100TTL:

LOCATION: Malacca
Apr 12 190752

Kynergy  

No 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Detaper Machine Kynergy:

LOCATION: Malacca
Mar 28 190359

DISCO CORPORATION  

DFD640 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Wafer Saw_DFD640:
Tsf_Wafer Saw_DFD640_DISCO-F-003
Mar 28 190358

DISCO CORPORATION  

DFD640 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Wafer Saw_DFD640:
Tsf_Wafer Saw_DFD640_DISCO-F-002
Mar 28 190357

DISCO CORPORATION  

DFD640 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   N*
Wafer Saw_DFD640:
Tsf_Wafer Saw_DFD640_DISCO-F-001
Mar 17 190258

Akrion  

Gama 

List all items of this typeWet Process Equipment - Other

in Wet Processing Equipment

1   N*
Akrion Gama:
Akrion Gama available from Mesa, AZ facility.
›Serial: 1071-01
›Software Rev: 6.05.009
›GEM/SECS: 3.09
›2 Input Queues
›Tank 1: HF
›Tank 2: DI Rinse
›Tank 3: SC1 (NH4OH, H2O2)
›Tank 4: Rinse
›EE Wash/Dry
›Tank 5: HF/HCl
›Tank 6: DI Rinse with HCl Inject (SC2)
›Tank 7: LuCID I Dryer
›2 Output Queues

LOCATION: Mesa
SERIAL NUMBER(S): 1071-01
Jan 30 189446

Mühlbauer  

DS10000 

List all items of this typeSemiconductor Manufacturing Equipment - Other

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1   F*N*
Muehlbauer Taper:
Tape & reel die sorting.
Jan 30 189445

Mühlbauer  

DS10000 

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1   N*
Muehlbauer Taper:
Tape & reel die sorting.
Nov 2 188171

DDS Development  

N/A 

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1   N*
WLP Stencil Storage Cabinet:
WLP Stencil Storage Cabinet
Nov 2 188170

Advantek  

Advantech Industrial CPU 

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1   F*N*
PC ADVANTECH INDUSTRIAL PC:
Industrial CPU for tester
Nov 2 188169

Sikama International  

M:Falcon 8500  

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1   N*
Curing Oven Sikama M:Falcon 8500 & Wet Clean:
Curing Oven Sikama M:Falcon 8500 & Wet Clean
Oct 6 187741

Shinkawa  

ACB 400 

List all items of this typeSemiconductor Manufacturing Equipment - Other

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3   N*
Wire Bonder ACB400:
To bond wire on the chip in strip to strips form
Oct 6 187740

Shinkawa  

ACB 400 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

5   N*
Wire Bonder ACB400:
To bond wire on the chip in strip to strips form


*  Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.