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FULL DESCRIPTION of Item 200885

in Other Semiconductor Manufacturing Equipment
Item ID: 200885

Offered 1 Offered at Best Price


Singulation Tool ABC development project


Singulation Tool from Hanmi with disco saw was rarely used for development project ABC

Excellent Condition (Basically New)
Complete (no missing parts)
No Damages

LOCATION: Tijuana Mexico

Process description:
Sawing of substrate and inspection and placement of devices

Features:
- Magazine load and offloading to Jedec tray
- Dual pick & place mechanism
- Dual chuck design and dual spindle, one blade / spindle
- Vision system with reject units sorting function
- Inspection includes (but no limited to): substrate orientation and substrate 2D code reader, device marking quality, broken devices, inked dot, package size X-Y, solder bumps quality

Substrate size: 178 x 127 mm (MAXIMUM)

Singulation Tool ABC development project
  Click to see additional image(s)... other images
Unit Price Unstated
Number of Units 1
Manufacturer Hanmi Semiconductor
Model Sawing & Placement 3800LD
Description Singulation Tool
Condition Like New
Year of Manufacture 2012
Power Requirements 220 V     60 Hz
Exterior Dimensions 
  Width 141.339  in  (359.0 cm)
  Depth 64.764  in  (164.5 cm)
click to view document at right in new windowABC development project

Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment