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in Other Wafer Fabrication Equipment
Item ID: 176318

Offered 1 Offered at Best Price

EVG850 Waferbonder

EVG850 Waferbonder, Year of Construction 2007
Unit Price Unstated
Number of Units 1
Manufacturer EVG
Model EVG850TB/200
Description Waferbonder for 6 inch wafers
Wafer Size Range 
  Minimum 150 mm
  Maximum 150 mm
  Set Size 150 mm
Cassette to Cassette YES
Condition Excellent
Year of Manufacture 2007
Power Requirements 230 V     6.9 A     50/60 Hz     3 Phase
click to view document at right in new windowEVG850tb.pptx
Serial Number(s)S070009

Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.

100% downpayment