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FULL DESCRIPTION of Item 187741

in Other Semiconductor Manufacturing Equipment
Item ID: 187741

Offered3 Offered at Best Price


Wire Bonder ACB400

To bond wire on the chip in strip to strips form
Wire Bonder ACB400
Unit Price Unstated
Number of Units 3
Manufacturer Shinkawa
Model ACB 400
Description WIre Bonder Machine
Condition Fair
Year of Manufacture 2003
Exterior Dimensions 
  Width 27.559  in  (70.0 cm)
  Depth 27.559  in  (70.0 cm)
  Height 73.228  in  (186.0 cm)
Weight 470  lb  (213 kg)
Shipping  Weight lb  kg 

Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment