Contact Us  |  Terms  |  Imprint  |  Privacy     
 Fast¬†¬†FIND      full search   tips    
  Specials  |  Listings:   Offered / Wanted / Both     |  Spare Parts Home     
Serving  Our Guest Log in    Register to speed trading
 MENU OF PRODUCT CATEGORIES    View    Search-by-Specs   

FULL DESCRIPTION of Item 191714

in Other Semiconductor Manufacturing Equipment
Item ID: 191714

Offered5 Offered at Best Price


Wire Bonder ACB1000

To bond wire on the chip in strip to strips form
Wire Bonder ACB1000
Unit Price Unstated
Number of Units 5
Manufacturer Shinkawa
Model ACB 1000
Description WIre Bonder Machine
Condition Good
Year of Manufacture 2010
Exterior Dimensions 
  Width 35.433  in  (90.0 cm)
  Depth 38.583  in  (98.0 cm)
  Height 74.803  in  (190.0 cm)
Weight 1,036  lb  (470 kg)
Shipping  Weight lb  kg 
Serial Number(s)SN62992,SN63109,SN64662,SN64663,SN64664

Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment