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FULL DESCRIPTION of Item 191716

in Other Semiconductor Manufacturing Equipment
Item ID: 191716

Offered1 Offered at Best Price


Dicer DFD670, SM06

Wafer sawing for 12" wafer
Dicer DFD670, SM06
Unit Price Unstated
Number of Units 1
Manufacturer DISCO CORPORATION
Model DFD 670
Description Dicer Machine
Condition Fair
Year of Manufacture 2005
Exterior Dimensions 
  Width 47.244  in  (120.0 cm)
  Depth 61.024  in  (155.0 cm)
  Height 72.047  in  (183.0 cm)
Weight 4,740  lb  (2,150 kg)

Shipping & Handling:

All Items are sold FCA Infineon location excluding packaging and delivery. We are not responsible for any damage incurred during shipment.
 
Payment:

100% downpayment