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Semiconductor / Hybrid Assembly Equipment


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Group Offers into sub-categories under Semiconductor / Hybrid Assembly EquipmentGroup Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment

List all 51 product types under Semiconductor / Hybrid Assembly EquipmentList all 51 product types under Semiconductor / Hybrid Assembly Equipment

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 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
203803

Shinkawa  

ACB35 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

3 sets of SHINKAWA ACB35 WIRE BOND:

SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052

3 lot ¥ 2,443,263.00
207363

Datacon  

2206 amp+ 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

DATACON Flip Chip Bonder 2206 amp+:

Correct Maintained

Complete. No parts missing

1 € 32,900.00
200489

ESEC  

ESEC3088 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2  
207622
FICO AMS-11-MR MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING:
AssetSNo.Asset nameAsset name2Physical LocationSerial no.
100060730FICO AMS-11-MR MOLDING201010012;Mal transfer DS line;inv#6JM/00883108 1FASSY5133182FC18
1 ¥ 4,910,590.66 N*
203804
Heraeus Oven & Oven Table 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot ¥ 31,003.00
204631
Lauffer Mold Press  

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 ¥ 2,526,419.44
158359

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1  
158364

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1   F*
207381
SHINKAWA ACB35 WIRE BOND 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 WIRE BOND:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110006475SHINKAWA ACB35 WIRE BOND8500018759;transfer from IFMY;inv# 6JM/00925108 1F ASSYF0-36534 S23

 

1 ¥ 932,760.30
204719
SHINKAWA ACB35 Wire Bond 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 Wire Bond:
100060530SHINKAWA ACB35 Wire Bond
100068240VISUAL INSPECTION SYSTEM
100068241hookup: VISUAL INSPECTION SYSTEM
100073050VISION INSPECTION MACHINE
3 ¥ 1,368,926.41
199782

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi

4  
203821

Shinkawa  

ACB400 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB400 WIRE BOND:

SHINKAWA WIRE BOND ACB400 10007322

WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT


LOCATION: Wuxi
1 ¥ 953,057.50
207382
TOSOK DBD 3280/3310 Die Bond 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD 3280/3310 Die Bond:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110005747TOSOK DBD3280 Die Bond.201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747CIQ inspect fee in Malacca201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747Conversion key1(X-Y wafer holder unit)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key4(loader-unloader)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37510006006TOSOK DBD3310 Die Bond .8500008995;Mal transfer DS line;inv# 6JM/00057/65108 1F ASSY295 T25
9F37510006006Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606108 1F ASSY295 T25
9F37510005536TOSOK DBD3310 Die Bond .PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536CIQ import inspection charge for TOSOK DBD3310 DiePO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536freight: TOSOK DBD3310 Die Bond 161 T26.PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F57010006036TOSOK DBD3310 DIE BOND8500007255;Mal transfer DS line;inv# 6JM/00884108 2F ASSY182-T86

 

4 ¥ 8,799,723.91
192458

tosok  

 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3200 Die Bond 161 T38 Training:

Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38

1  
204630
TOSOK DBD3310 3280 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 3280 DIE BOND:

TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748

4 ¥ 6,569,652.00
199781

tosok  

3310 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi

4  
207602
TRIM FORM MACHINE 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TRIM FORM MACHINE:
AssetAsset nameAsset name2Serial no.
10007004TRIM FORM MACHINE8500033677;transfer asset from IFMY; 6JM/00758TF-17
1 ¥ 1,368,171.00 N*
207601
Wafer inker machine 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Wafer inker machine:
AssetAsset nameAsset name2Serial no.
10009379Wafer Inker MachineA-17-3040-37-D019-T-01; 85000803450211-3296 INK-11
10006598Wafer inker machine8500022900;transfer from IFMY; 6JM/01085APR-WX-001

 

2 ¥ 1,024,300.00 N*
207362
Wire Bonder UTC-3000 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire Bonder UTC-3000:

Serial number: 66330

Correct maintained

Complete. No parts missing

 

1   F*


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.