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Semiconductor / Hybrid Assembly Equipment


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Group Offers into sub-categories under Semiconductor / Hybrid Assembly EquipmentGroup Offers into sub-categories under Semiconductor / Hybrid Assembly Equipment

List all 51 product types under Semiconductor / Hybrid Assembly EquipmentList all 51 product types under Semiconductor / Hybrid Assembly Equipment

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 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
203803

Shinkawa  

ACB35 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

3 sets of SHINKAWA ACB35 WIRE BOND:

SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052

3 lot ¥ 2,443,263.00
200489

ESEC  

ESEC3088 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2  
203804
Heraeus Oven & Oven Table 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot ¥ 31,003.00
204631
Lauffer Mold Press  

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 ¥ 2,526,419.44
158359

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1  
158364

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1   F*
204719
SHINKAWA ACB35 Wire Bond 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 Wire Bond:
100060530SHINKAWA ACB35 Wire Bond
100068240VISUAL INSPECTION SYSTEM
100068241hookup: VISUAL INSPECTION SYSTEM
100073050VISION INSPECTION MACHINE
3 ¥ 1,368,926.41
199782

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi

4  
203821

Shinkawa  

ACB400 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB400 WIRE BOND:

SHINKAWA WIRE BOND ACB400 10007322

WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT


LOCATION: Wuxi
1 ¥ 953,057.50
192458

tosok  

 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3200 Die Bond 161 T38 Training:

Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38

1  
204630
TOSOK DBD3310 3280 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 3280 DIE BOND:

TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748

4 ¥ 6,569,652.00
199781

tosok  

3310 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi

4  


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.