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 Offered (box) or Wanted (coins)  Item ID  Short Description Product Type / Details # Price Notes
Make Model
   
203808
2 SET FICO AMS-11-MR MOLDING 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

2 SET FICO AMS-11-MR MOLDING:
FICO AMS-11-MR MOLDING 10005450/10006825

 

2 lot ¥ 8,775,312.00
203088
2 set of inline tester 

List all items of this typeRetho Test Equipment

in Automatic Test Equipment

2 set of inline tester:

2 set of inline tester

asset no:10005027 & 10005029


LOCATION: Wuxi
2 ¥ 5,787,004.00
203803

Shinkawa  

ACB35 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

3 sets of SHINKAWA ACB35 WIRE BOND:

SHINKAWA ACB35 WIRE BOND 10005446/ 10007081/ 10006052

3 lot ¥ 2,443,263.00
207383

Koh Young Techn. Inc  

KY8030-2 Size L 

List all items of this typeOptical Test & Measurement Equipment - Other

in Optical Test & Measurement Equipment

3D- Inline Solder Paste Inspection System Koh Young SPI:

 3 D Solder Paste Inspection System Model KY8030-2 Size L

1 € 0.00 F*N*
173938
Aixtron G4 SPARE PARTS 

List all items of this typeSpare Parts

in ALL CATEGORIES

Aixtron G4 SPARE PARTS:

Various spare items for Aixtron G4  (see Excel list attached)
excellent condition
-new/unused-
Location: Villach - Austria

1  
204578

Orbotech  

Ultra Discovery VM 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

AOI Orbotech Ultra Discovery VM:

Simple, Intelligent, Powerful

Ultra Discovery VM delivers Simple, Intelligent and Powerful AOI performance with 10µm line/space inspection capabilities for FC-BGA, PBGA, CSP and COF production.

Delivering super clear images essential for capturing the finest defects, the system achieves outstanding AOI results with minimal effort or training, even on complicated panels. Most of manufacturers’ valuable time on the system is spent inspecting panels. Logic false calls are virtually eliminated and overall false calls are minimized saving precious verification time.

Benefits

  • High throughput and superior detection with minimal number of false calls
  • Especially designed for inspection of the finest lines down to 10μm
  • Quick set-up even for the most complicated jobs for higher productivity
  • Automation ready
  • Very high uptime
  • SIP TechnologyTM

    Push-to-Scan®:

    • A ‘no set-up’ process
    • Top AOI results with minimal effort or training
    • The easiest, user-friendly interface (GUI)
    • Full ‘Step and Repeat’ functions

    Visual Intelligence:

    Using SIP Technology, Ultra Discovery VM introduces Orbotech’s detection paradigm to the world of fine-line FC-BGA, PBGA/CSP and COF production. With the Visual Intelligence Detection Engine – now dedicated for IC substrate applications - manufacturers no longer have to choose between detection and false calls or waste time on non-critical defects. For the first time in AOI, detect all you want, and only what you want.

    Ultra Discovery VM is equipped with a super-fast optical head, which together with its dedicated IC substrate panel understanding, delivers exceptionally high throughput, superior detection and low false call rates. The optical head is specially designed for inspection of the finest lines down to 10µm. The customized professional lens, featuring unique wide angle illumination, delivers very clear images essential for capturing the finest defects.

    Visual Intelligence:

    • Full panel understanding, context-based detection engine
    • Equipped with ultra-fast sensors and powerful data processing for maximum inspection speed

       

 

1   F*
205023

Axcelis Technologies  

Fusion PS3 

List all items of this typeLithography Equipment - Other

in Lithography Equipment

Axcelis Fusion PS3:

With 2 Chambers UV bake.

1  
191094

Dainippon Screen  

SC-W60A-AV 

List all items of this typeManual Photoresist Coaters

in Photoresist Coaters

B604 SCREEN DNS SCW60B:
Coater with 4 horizontal load ports
2 coater cups
6 resist lines with 3 pumps
8 hot plates (2 of them ADH HP)
2 cool plates
1 temperature controller / unit
2  
204380

Infineon  

Bruchless Motor bench 

List all items of this typeTest & Measurement - Other

in Test & Measurement Equipment

Bruchless Motor bench:

Bruchless Motor bench assembled in our Provence Design Center, like new (only tested once).

For more informations please refer to the enclosed diagram and the motor description below. 

Brushless motor PMSM ME0913 24 to 96V VDC 12kW (30kW max)

This three-phase motor works with the Kelly controller (described below)

• Output Power of 12 KW Continuous, 30 KW Peak (at 96 volts)

• Designed for long life. No brush maintenance. The motor is 92% efficient at voltages between 24 to 96 VDC. Continuous current of 125 amps AC (180 Amps DC into the motor control). This is a 3-phase, Y-connected Permanent Magnet Synchronous Motor with an axial air gap and 3 Hall sensors at 120 degrees electrical timing. It has two stators with a rotor in the center.

• This is a 4 pole motor (8 magnets).

• The Phase to Phase winding resistance is 0.013 Ohms.

• The maximum recommended rotor speed is 5000 RPM.

• Voltages from 0 to 96 VDC input to the control.

• Torque constant of 0.15 Nm per Amp

• The Inductance Phase to Phase is 0.10 Milli-Henry with a 28 turns per phase.

• Armature Inertia is 45 Kg Cm Squared.

• Continuous current of 125 Amps AC (180 Amps DC into the motor control).

• Peak current of 420 Amps AC for 1 minute (600 Amps DC into the motor control).

• Weight of 35 pounds.

• Peak Stall Torque of 90 Nm (66 ft).

• This is an Open Frame, Fan Cooled motor. Timed for counter-clockwise rotation (can be changed to clockwise).

 

Kelly KBL72301,24-72V,300A,BLDC Controller/With Regen

Kelly KBL programmable BLDC motor controller provides efficient, smooth and quiet controls for golf cart, go-cart, electric motorcycle, forklift, hybrid vehicle, electrical vehicle, electric boat, as well as industry motor speed or torque control.

Motor speed controller uses high power MOSFET, PWM to achieve efficiency 99% in most cases. Powerful microprocessor brings in comprehensive and precise control to BLDC motor controllers. This programmable brushless motor controller also allows users to set parameters, conduct tests, and obtain diagnostic information quickly and easily.

Features:

• Intelligence with powerful microprocessor. Synchronous rectification, ultra low drop and fast PWM to achieve very high efficiency.

• Electronic reversing.

• Voltage monitoring on 3 motor phases, bus, and power supply.Voltage monitoring on voltage source 12V and 5V.

• Current sense on all 3 motor phases.Current control loop.

• Hardware over current protection.Hardware over voltage protection.

• Support torque mode, speed mode, and balanced mode operation.

• Configurable limit for motor current and battery current.

• Low EMC.LED fault code.

• Battery protection: current cutback, warning and shutdown at configurable high and low battery voltage.

• Rugged aluminum housing for maximum heat dissipation and harsh environment.Rugged high current terminals, and rugged aviation connectors for small signal.

• Thermal protection: current cut back, warning and shutdown on high temperature.Configurable 60 degree or 120 degree hall position sensors.

1 lot  
197661

Canon  

FPA-1550 M4-W 

List all items of this typeG-Line Wafer Steppers

in Wafer Steppers

1   F*
166465

Oxford Instruments  

CMI 950 

List all items of this typeXray Fluorescence Spectrometers

in Spectrometers

CMI 950 - Xray fluorescence spectrometer:
X-Ray fluorescence for analysis of materials (such as liquids and solid states) in order to obtain information about thickness, concentrataion, etc.
Measurement system for layer thickness analysis of metallic surfaces and evaluation of concentrations of solutions (Au, Ni, Sn, Cu, Ag).

System is fully packed on pallette (241kg, 1mx0,9mx1,5m)
1   F*
199395

IPEC Westech  

IPEC472 

List all items of this typeCMP Polishers

in Chemical Mechanical Planarization Equipment

1   F*
207199

ASYS  

BC0 01 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS BC0 01:

Conveyor ASYS BC0 01

1   N*
207198

ASYS  

TRM02 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Conveyor ASYS TRM02:

Conveyor ASYS TRM02

1   N*
204220
Cyberscan CT350T Dual non-contact double-sided optical profilometer 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Cyberscan CT350T Dual non-contact double-sided optical profilometer:

2 Tools

- DUAL NON-CONTACT MEASUREMENT SYSTEM
- 3D MAPPING OF THICKNESS,BOW, WARPAGE AND ROUHGNESS
- USER FRIENDLY CONCEPT
- SOPHISTICATED ANALYSIS AND AUTOMATION SOFTWARE

Tools are still running in production. Available from May/June 2019

Inspection already possible!

The tools are pretty new and rarely used. Vintage 2018 and 2015 

The CT 350T was originally designed for measuring
thickness of substrates and wafers. It provides
accurate measurements independent of material
and surface properties. There is no limitation on the
minimum thickness, even measurements of samples
with a thickness of only a few microns can easily be
taken.

Please be invited to take a look at the pictures.

2   F*
195768

Dainippon Screen  

SCW-60A-AV 

List all items of this typeManual Photoresist Coaters

in Photoresist Coaters

Dainippon Screen Coater:
Coater with 2 Coatercups
1   F*
195767

Dainippon Screen  

SDW-60A-AVP 

List all items of this typeManual Photoresist Developers

in Photoresist Developers

Dainippon Screen Developer:
Developer with 2 Developercups
1  
197510

Dainippon Screen  

SCW-60A-AV 

List all items of this typeStandard PR Coater Tracks

in Photoresist Coater Tracks

Dainippon Screen SCW-60A-AV:
Coater with 2 Coatercups
1   F*
197633

Dainippon Screen  

SDW-60A-AVP 

List all items of this typeProgrammable Robotic Photoresist Develop Tracks

in Photoresist Develop Track Systems

Dainippon Screen SDW-60A-AVP:

Developer with 2 Developercups

1   F*
207363

Datacon  

2206 amp+ 

List all items of this typeAutomatic Flip Chip Bonders

in Flip Chip Bonders

DATACON Flip Chip Bonder 2206 amp+:

Correct Maintained

Complete. No parts missing

1 € 32,900.00 N*
180517

Dainippon Screen  

SDW-60-AVP 

List all items of this typeStandard Photoresist DevTracks

in Photoresist Develop Track Systems

Developer DNS SDW-60-AVP:
6 inch developer from dai nippon screen SDW-60-AVP, 2 developing units, full functional
Location: Regensburg, Bavaria
1   F*
157438

Dainippon Screen  

SDW60 AVP 

List all items of this typeStandard Photoresist DevTracks

in Photoresist Develop Track Systems

Developer DNS SDW-60-AVP:
6 inch developer from dai nippon screen SDW-60-AVP, 2 developing units, full functional
1   F*
195189
Drilling machine bernhard steinel 

List all items of this typeMixed Lots of Lab and Other Technical Equipment

in Laboratory Equipment

Drilling machine bernhard steinel:

Already damaged loses function, was unable to repair.
LOCATION: Wuxi

1 € 0.00
202651

Aixtron  

Aixtron AIX2800G4 

List all items of this typeEpitaxial Cluster Tools

in Epitaxial Reactors

EPI Aixtron G4:

With many spare parts.

1  
200489

ESEC  

ESEC3088 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

ESEC3088 WireBonder 2 sets:
ESEC3088 Wirebonder 2 sets Asset no.: 10004822/10004823
LOCATION: Wuxi
2  
202691
EVG820 Dry Film Lamination System 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

EVG820 Dry Film Lamination System:

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.

1  
202692
EVG820 Dry Film Lamination System 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

EVG820 Dry Film Lamination System:

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely [INVALID]able and independent from substrate.

1  
206584
Fico AMS-11-MR Molding 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Fico AMS-11-MR Molding:
AssetAsset nameAsset name2Physical LocationSerial no.
10004762Inline VI WorkStationTransfer AGCC LINE 21VIF-19
10004924Fico AMS-11-MR MoldingTransfer AG, PO#200710494CC LINE 21INF6312182
10005047Buffer200710495;A-07-3040-37-C017-T-01;IFAG#633451493CC LINE 21BF-048
10004763Inline VI WorkStationTransfer AGCC LINE 21VIB-19

 

4 ¥ 4,052,063.00 F*N*
207622
FICO AMS-11-MR MOLDING 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

FICO AMS-11-MR MOLDING:
AssetSNo.Asset nameAsset name2Physical LocationSerial no.
100060730FICO AMS-11-MR MOLDING201010012;Mal transfer DS line;inv#6JM/00883108 1FASSY5133182FC18
1 ¥ 4,910,590.66 N*
204613

FinnSonic  

Versa+ 80/VI HDD TD35 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

FinnSonic Versa+ 80/VI HDD TD35 Cleaning Line:

automated cleaning line (basket handling)

Versa +80 Rinse

Versa +80 U/S

Versa +80 U/S

Versa +80 Rinse

Versa +80 Rinse

Versa +80 Rinse

circulating air dryer

1   F*
203804
Heraeus Oven & Oven Table 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Heraeus Oven & Oven Table:

Heraeus Oven & Oven Table

10002755 Oven
10004959 Oven Table
2 lot ¥ 31,003.00
202596
INGERSOLL RAND heat reactivated regenerative air dryers 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

INGERSOLL RAND heat reactivated regenerative air dryers:

INGERSOLL RAND heat reactivated regenerative air dryers 1000984/9845/9846

 

 


LOCATION: Wuxi
1 ¥ 391,740.00
200487
Kaeser Compressor 

List all items of this typeSemiconductor Facilities Equipment - Other

in Semiconductor Manufacturing Facilities Equipment

1  
203166

ESI  

Model 9350 

List all items of this typeLaser Memory Repair Tools

in Laser Based Tools

Laser Cutter ESI 9350:

Redundanz activation system

1  
204631
Lauffer Mold Press  

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Lauffer Mold Press :

Lauffer Mold Press/100050250

Mold-Die, 5% Mark up from MY/100050251

CURING OVEN/100050260

 

2 ¥ 2,526,419.44
204582
Lenz DLG 615- 1+1 AL, High Precision Drilling/Routing Machine 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   F*
203171

LTX  

Fusion HT 

List all items of this typeDigital Test Systems

in Device Testers

1  
203172

LTX  

Fusion HT 

List all items of this typeDigital Test Systems

in Device Testers

1  
202806

LTX  

Synchro II Tester 

List all items of this typeDigital Test Systems

in Device Testers

1  
205912

Matrix Corp  

Matrix X3 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

Matrix X3 X-Ray System:

high speed X-Ray system 

1  
155055

Hitachi  

VP-1500 

List all items of this typeScientific and Laboratory Equipment - Other

in Laboratory Equipment

MONOCHROME COPIER:
MONOCHROME COPIER

MONOCHROME COPIER
LOCATION: Malacca
SERIAL NUMBER(S): TA0101513
1 € 2,662.70
147228

Multitest  

MT8502 

List all items of this typeDIP Handlers

in Device Handlers

Multitest MT8502 TriTemp gravity Handler:
Multitest MT8502 TriTemp gravity Handler

Multitest MT8502 TriTemp gravity Handler
LOCATION: MchC
SERIAL NUMBER(S): na
1   F*
198620
Nabertherm Furnance 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Nabertherm Furnance:
Furnance PLC controlled with touch screen
1  
207180
Nanofocus µsprint 3d inspection system with Baumann Handler 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

1 € 50,000.00 N*
203189

NexGen Technologies  

Nexgen Prober 2013 Model 

List all items of this typeProbe Equipment - Other

in Wafer Probers

NEXGEN SEMI AUTOMATIC PROBER:

NexGen semi-automatic prober

for 3,4,5,6 & 8 inches wafer with hot chuck PCB to 130°.

More information available below and on the enclosed flyer :

Accuracy within 6 Microns and Maximum X/Y Speed 250 mm (10") sec

ZStage/Chuck 

- Range : 0.200" (other configurations available)

- Speed : 11 ms

Loader (Wafer Handler)

- Cassette capacity : 2 Standard; 1 sender, 1 receiver

- Wafer handling : Belt and vacuum arm

- Fine alignment : CCD Image Processing

- Hard Disk Drive : 60 -250 gig

- Disk Drives : USB, CD/RW, DVD Writer

- Display : 22" Color Screen Monitor

- Power consumption (included) : 1.5 KVA

Facilities Required

- Air : 75 PSI @ 3 CFM

- Vacuum : 25in/hg

- Dimensions 

InchesCm
48"w x 32"d x  60"h115 (L) x 80 (l) x 140 (h)

 - Weight 

LbKg
700317
1  
202453

Nitto Denko  

Nitto MSA840 

List all items of this typeWafer Production Equipment - Other

in Production Equipment

Nitto MSA840 Mounting Machine 10004095:

Nitto MSA840 Mounting Machine

1 € 53,281.00
204579

OGP Messtechnik GmbH  

Smart Scope CNC 500 

List all items of this typeMiscellaneous Metrology Equipment

in Metrology Equipment

OGP Smart Scope CNC500:

CNC Measurement Tool

1  
192280
Over Head Transport System (OHT) SRC320 / SRC300 / LIM  

List all items of this typeSemiconductor Facilities Equipment - Other

in Semiconductor Manufacturing Facilities Equipment

Over Head Transport System (OHT) SRC320 / SRC300 / LIM :



A high quantity of straigths, curves, course taker and other tracks

 

Please get in touch with the Equipment Trade Commodity Manager to get more information or price lists.

 

1  
191902

Diener  

Diener Tetra 30-LF-PC 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Plasma Clean Machine:

LOCATION: MALACCA

1   F*
204583
Process Photonics LaserDrilling/Cutting Tool 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1  
204584

PPI Systems Inc.  

FP-C2 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

1   F*
196680

Rasco  

SO2000 

List all items of this typeSMD Handlers

in Device Handlers

Rasco SO2000:

Rasco SO2000

Specifications

  • Handling, Inspection, Packing System
  • Throughput up to 16,000 ICs/hour
  • Index time down to 0.45 s
  • Conversion kits for all SO and QFN devices down to 1.5 mm, incl. QFN thin
  • Full split kit capability
  • Ambient/hot/tri-temp -60°C ... +175°C
  • Large variety of contactors: Kelvin, RF, Pogo, ECT, Johnstech, Yamaichi, C-Type
  • MEMS applications for magnetic, optical, pressure and acoustic sensors
  • Multiple input and output modules:
    Tube, bowl (SOT and QFN), metal magazine, bulk, tape and reel
  • Rasco Vision System: Mark/3D-lead/intape inspection
1   F*
169359

PILL  

Export 250 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Resist development equipment (PILL):

Infineon offers equipment from supplier Pill used for solder resist development (working width max. 250mm)

1   F*
158359

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1  
158364

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

1   F*
207381
SHINKAWA ACB35 WIRE BOND 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 WIRE BOND:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110006475SHINKAWA ACB35 WIRE BOND8500018759;transfer from IFMY;inv# 6JM/00925108 1F ASSYF0-36534 S23

 

1 ¥ 932,760.30 N*
204719
SHINKAWA ACB35 Wire Bond 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB35 Wire Bond:
100060530SHINKAWA ACB35 Wire Bond
100068240VISUAL INSPECTION SYSTEM
100068241hookup: VISUAL INSPECTION SYSTEM
100073050VISION INSPECTION MACHINE
3 ¥ 1,368,926.41
199782

Shinkawa  

ACB35 

List all items of this typeAutomatic Ball Bonders

in Ball Bonders

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165:

SHINKAWA ACB35 WIRE BOND 4 sets S162 S163 S164 S165 Asset no.: 10005848/5849/5850/5851
LOCATION: Wuxi

4  
203821

Shinkawa  

ACB400 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

SHINKAWA ACB400 WIRE BOND:

SHINKAWA WIRE BOND ACB400 10007322

WIRE CLAMPER/TRANSDUCER UST-200-1/COPPER WIRE KIT


LOCATION: Wuxi
1 ¥ 953,057.50
207183

Siemens  

Siemens Siplace F4 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Siemens Siplace F4 pick and place mounter:

Siemens Siplace F4 pick and place mounter

1   N*
207184

Siemens  

Siemens Siplace HS 50 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Siemens Siplace HS 50 pick and place mounter:

Siemens Siplace HS 50 pick and place mounter

1   N*
203807
SIENMENS Backside Laser Machine 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

SIENMENS Backside Laser Machine:
SIENMENS Backside Laser Machine  10004655

 

1 ¥ 554,552.00
200885

Hanmi Semiconductor  

Sawing & Placement 3800LD 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Singulation Tool ABC development project:


Singulation Tool from Hanmi with disco saw was rarely used for development project ABC

Excellent Condition (Basically New)
Complete (no missing parts)
No Damages

LOCATION: Tijuana Mexico

Process description:
Sawing of substrate and inspection and placement of devices

Features:
- Magazine load and offloading to Jedec tray
- Dual pick & place mechanism
- Dual chuck design and dual spindle, one blade / spindle
- Vision system with reject units sorting function
- Inspection includes (but no limited to): substrate orientation and substrate 2D code reader, device marking quality, broken devices, inked dot, package size X-Y, solder bumps quality

Substrate size: 178 x 127 mm (MAXIMUM)

1   F*
207181

EKRA  

E4 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Solder Paste Printer Ekra E4:

Solder Paste Printer Ekra E4

1   N*
207182

EKRA  

Solder Paste Printer Ekra X5 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Solder Paste Printer Ekra X5:

Solder Paste Printer Ekra X5

1   N*
207356
SPEA Tester 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

SPEA Tester:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F40510004286SPEA C320MX TesterPO 200510501 BNE A-05-3040-41-P005-T-02CC FCOSRAE074CC
9F40510004379SPEA C320MX Tester200610235 a-06-3040-37-c004-a-01CC FCOSRAG087CC
9F40510004379freight for SPEA comptest 320-MX-32200610235 a-06-3040-37-c004-a-01CC FCOS0
9F40510004602SPEA C320MX TesterTransfer AG, PO#200710213CC FCOSRAE076CC
9F40510004646SPEA C320MX TesterTransfer AGCC FCOSRAE077CC

 

4 ¥ 7,488,255.14 N*
200884

KLA -Tencor  

CI-T1X0 Rev3 

List all items of this typeSemiconductor Manufacturing Equipment - Other

in ALL CATEGORIES

Tape & Reel Tool ABC development project:

Tape & Reel Tool from KLA-Tencor was rarely used for development project ABC

Excellent Condition (Basically New)
Complete (no missing parts)
No Damages


LOCATION: Tijuana Mexico

Process description:
Transfer and inspection of singulated devices from Jedec tray to Tape & Reel packing

Features:
- 2D inspection system
- Loading from Jedec tray or Tape & Reel
- Output to Jedec tray or Tape & Reel
- Statistics process control tool
- 10 head handler for high speed inspection
- quadruple pick-and-place head for taping

1  
202601

Teradyne  

J971-61 SML 256CH1TH 

List all items of this typeDigital Test Systems

in Device Testers

Teradyne J971:

Tool in good condition. Still in running production. Tool will be released from production beginning of July 2019

 

 

1  
206570
TEST EQUIPMENT(QS) OQA related 

List all items of this typeOther Items and Mixed Lots

in ALL CATEGORIES

TEST EQUIPMENT(QS) OQA related:
AssetAsset nameAsset name2Physical LocationSerial no.
100034274395A-RS/RF TESTERPO 200210136 BNE 20020006W117 1F OQA ROOM0
10008752ITC55100 Avalanche Tester8500065361;6JM/00741DS 117 1F OQA10113
10006360RF/RS 2-TEST EQUIPMENT(QS) (OLD)4195A8500013980;transfer line from IFMY;inv#6JM/00859117 1F OQA ROOM2904J01823
10006305Test Fixture (OLD)8500016782;TRANSFER FROM IFMY;inv# 6JM/00494-496117 1F OQA ROOMDS-TSFP4-CL

 

4 ¥ 1,661,793.74
200892

Multitest  

MT2168 

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Test Tool ABC development project:

Test Tool from multitest was rarely used for development project ABC

- Excellent Condition (Basically new)
- Complete (no missing parts) 
- No Damages

LOCATION: Tijuana Mexico


Description: 
- Fully testing COOLiR2DIE at high current and voltage presents challenges for a test system and handler
> Test team chose the LEMSYS test solution
> Tester capability:  2000A/2000V for static and 2000A/1500V for dynamic testing
- The handler choice was limited due to the package size and exposed die
- Multitest with vertically docked pick & place handlers
> A custom manipulator from ESMO was required to provide a working interface on a “headless” LEMSYS tester




1   F*
207382
TOSOK DBD 3280/3310 Die Bond 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD 3280/3310 Die Bond:
Cost ctr.AssetAsset nameAsset name2Physical LocationSerial no.
9F37110005747TOSOK DBD3280 Die Bond.201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747CIQ inspect fee in Malacca201010234;A-10-3040-37-D008-T-09; inv#6JM/00518108 1F ASSY169 T13
9F37110005747Conversion key1(X-Y wafer holder unit)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key2(Mushroom)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37110005747Conversion key4(loader-unloader)8500011184;A-11-3040-37-D014-A-01;inv#07613299/300108 1F ASSY169 T13
9F37510006006TOSOK DBD3310 Die Bond .8500008995;Mal transfer DS line;inv# 6JM/00057/65108 1F ASSY295 T25
9F37510006006Ceramic heater(NRQ00010R)8500015375;A-11-3040-37-D030-A-01;inv#EG20110606108 1F ASSY295 T25
9F37510005536TOSOK DBD3310 Die Bond .PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536CIQ import inspection charge for TOSOK DBD3310 DiePO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F37510005536freight: TOSOK DBD3310 Die Bond 161 T26.PO#201010006/Inv:6JM/00232108 1F ASSY161 T26
9F57010006036TOSOK DBD3310 DIE BOND8500007255;Mal transfer DS line;inv# 6JM/00884108 2F ASSY182-T86

 

4 ¥ 8,799,723.91 N*
192458

tosok  

 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3200 Die Bond 161 T38 Training:

Unfunctional, unable to repair, spare parts removed
LOCATION: Wuxi
SERIAL NUMBER(S): 161T38

1  
204630
TOSOK DBD3310 3280 DIE BOND 

List all items of this typeAutomatic Eutectic Die Bonders

in Eutectic Die Bonders

TOSOK DBD3310 3280 DIE BOND:

TOSOK DBD3310 DIE BOND 10005730/10006037/10006038
TOSOK DBD3280 Die Bond 10005748

4 ¥ 6,569,652.00
199781

tosok  

3310 

List all items of this typeAutomatic Epoxy Die Bonders

in Epoxy Die Bonders

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71:

TOSOK DBD3310 DIE BOND 4 sets T68 T69 T70 T71Asset no. 10005226/5227/5228/5229
LOCATION: Wuxi

4  
207602
TRIM FORM MACHINE 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

TRIM FORM MACHINE:
AssetAsset nameAsset name2Serial no.
10007004TRIM FORM MACHINE8500033677;transfer asset from IFMY; 6JM/00758TF-17
1 ¥ 1,368,171.00 N*
180602

Ultratech, Inc.  

1500 

List all items of this typeI-Line Wafer Stepper

in Wafer Steppers

Ultratech 1500 - Wafer Stepper - 6":
Used Ultratech 1500 - 6" Wafer Stepper
1   F*
207196

VacuMit  

EST60 

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Vacuum packing machine VecuMit EST60:

Vacuum packing machine VecuMit EST60, without N2 floating

1   F*N*
199806
Vision Inspection Machine 2 sets 

List all items of this typeOptical Inspection - Other

in Optical Inspection Equipment

Vision Inspection Machine 2 sets:

Vision Inspection Machine 2 setsAsset no. 10006671/7305
LOCATION: Wuxi

2  
207601
Wafer inker machine 

List all items of this typeAssembly / Hybrid - Other

in Semiconductor / Hybrid Assembly Equipment

Wafer inker machine:
AssetAsset nameAsset name2Serial no.
10009379Wafer Inker MachineA-17-3040-37-D019-T-01; 85000803450211-3296 INK-11
10006598Wafer inker machine8500022900;transfer from IFMY; 6JM/01085APR-WX-001

 

2 ¥ 1,024,300.00 N*
205889
Wire Bonder Hesse & Knipps Bondjet 820 

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Wire Bonder Hesse & Knipps Bondjet 820:

 

230V / 60 Hz / 5A  Compressed Air, Vacuum

Useable for Handles Al wire (0.7mil “ 3mil).  No Au or ribbon wires.  E-Box option “ visualization system for control supported, reproducible adjustments of bondhead elements.

Content a upgrade for deep access (90 degree) bond head.

Tool is in a good condition

Tool still in Production floor clean room

1 $ 22,000.00
207197

Kulicke&Soffa  

Powerfusion 

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Wire Bonder K&S Powerfusion Alu Wedge Bonder:

Wire Bonder K&S Powerfusion Alu Wedge Bonder

1   N*
207362
Wire Bonder UTC-3000 

List all items of this typeWire Bonding Equipment - Other

in Wire Bonders

Wire Bonder UTC-3000:

Serial number: 66330

Correct maintained

Complete. No parts missing

 

1   F*N*
203806
Yamato NDB-4 CO2 Bubbler  

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Yamato NDB-4 CO2 Bubbler :

Yamato NDB-4 CO2 Bubbler 10005165

1 ¥ 290,277.00
199836
Yes Ofen PB-6-8P 

List all items of this typeThermal Processing Equipment - Other

in Thermal Processing Equipment

Yes Ofen PB-6-8P:
Furnance with 4 Chambers.
1  


*   Vendor Role: Mfr is Manufacturer; Sup is Supplier/Distributor; OEM is Original Equipment Manufacturer

NOTE:
   photo available
   reference document attached
  F* if the item is specially featured
  N* if the item is newly added, and/or
  R* if the item's price is recently reduced.